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  this is information on a product in full production. august 2013 docid024631 rev 2 1/8 8 stpsc6h12 1200 v power schottky silicon carbide diode datasheet - production data features ? high frequency free-wheel / boost diode ? robust high-voltage periphery ? ultrafast high voltage switching independent of temperature description st's 1200 v high-performance rectifier is specifically designed to be used in photo-voltaic inverters or in applicat ions where negligible switching losses are required. the stpsc6h12 helps to increase the application efficiency yield by up to 2% thanks to its ability to work at high frequency whatever the temperature. the central lead of the dpak package is removed to meet the iec60664 and ul 840 standards requirements for a higher voltage. these characteristics make it the best-in-class 1200 v diode. k a k a nc dpak hv 2l STPSC6H12B-TR1 table 1. device summary symbol value i f(av) 6 a v rrm 1200 v t j (max) 175 c v f (6 a, 25 c) typ. 1.55 v c j (300 v) typ. 30 pf www.st.com
characteristics stpsc6h12 2/8 docid024631 rev 2 1 characteristics to evaluate the conduction loss es use the following equation: p = 0.89 x i f(av) + 0.285 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 1200 v i f(rms) forward rms current 11 a i f(av) average forward current t c = 125 c, ? = 0.5 6 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t a = 25 c t p = 10 ms sinusoidal, t a = 150 c t p = 10 s square, t a = 25 c 36 30 100 a i frm repetitive peak forward current ? = 0.1, t c = 125 c 28 a t stg storage temperature range -65 to +175 c t j operating junction temperature range (1) 1. condition to avoid thermal runaway for a diode on its own heatsink -40 to +175 c table 3. thermal resistance symbol parameter typ. max. unit r th(j-c) junction to case 1.3 1.9 c/w table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. t p = 10 ms, ? < 2% reverse leakage current t j = 25 c v r = v rrm -100400 a t j = 150 c - 0.65 1.5 ma v f (2) 2. t p = 500 s, ? < 2% forward voltage drop t j = 25 c i f = 6 a -1.551.9 v t j = 150 c - 2.05 2.6 table 5. dynamic electrical characteristics symbol parameter test conditions typ. unit q cj (1) 1. most accurate value fo r the capacitive charge: total capacitive charge v r = 800 v 29 nc c j total capacitance v r = 0 v, t c = 25 c, f = 1 mhz 330 pf v r = 300 v, t c = 25 c, f = 1 mhz 30 dptot dtj < 1 rth(j-a) q = c j (v r ).dv r cj v out 0
docid024631 rev 2 3/8 stpsc6h12 characteristics figure 1. forward voltage drop versus forward current (typical values) figure 2. reverse leakage current versus reverse voltage applied (typical values) a) i f ( 0 2 4 6 8 10 12 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 t a =150 c t a =25 c pulse test : t p =500 s v fm (v) i r (a) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 t j =25 c t j =150 c v r (v) figure 3. peak forward current versus case temperature figure 4. junction capacitance versus reverse voltage applied (typical values) i m (a) 0 10 20 30 40 0 25 50 75 100 125 150 175  =0.1  =0.3  =0.5  =1  =0.7 t  =tp/t tp t c (c) c j (pf) 0 50 100 150 200 250 300 350 0.1 1.0 10.0 100.0 1000.0 10000.0 f=1 mhz v osc =30 mv rms t j =25 c v r (v) figure 5. relative variation of thermal impedance junction to case versus pulse duration figure 6. non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t p (s) i fsm (a) 1.e+01 1.e+02 1.e+03 1.e-05 1.e-04 1.e-03 1.e-02 t a =25 c t a =150 c t p (s)
characteristics stpsc6h12 4/8 docid024631 rev 2 figure 7. total capacitive charges versus reverse voltage applied (typical values) q cj (nc) 0 5 10 15 20 25 30 0 100 200 300 400 500 600 700 800 v r (v)
docid024631 rev 2 5/8 stpsc6h12 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. dpak hv 2l dimension definitions d d1 l4 e b l3 e e1 b3 h m c a c2 a1 p l
package information stpsc6h12 6/8 docid024631 rev 2 figure 9. footprint (dimensions in mm) table 6. dpak hv 2l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.16 2.29 2.40 0.085 0.090 0.094 a1 0.06 0.08 0.13 0.002 0.003 0.005 b 0.71 0.76 1.07 0.028 0.029 0.030 b3 5.004 5.10 5.21 0.197 0.201 0.205 c 0.46 0.51 0.56 0.018 0.020 0.025 c2 0.76 0.81 0.86 0.029 0.032 0.034 d 5.97 6.10 6.22 0.235 0.240 0.245 d1 5.84 ref 0.230 ref e 6.48 6.60 6.73 0.255 0.260 0.265 e1 4.95 5.08 5.21 0.195 0.200 0.205 e 2.29 ref 0.90 ref h 9.70 9.83 10.08 0.382 0.387 0.397 l 1.02 1.14 1.40 0.040 0.045 0.055 l3 1.14 0.045 l4 (1) 1. maximum plastic protrusion 0.000 0.15 0.000 0.006 m7 7 p5 5 6.3 6.1 10.7 2.8 1.5 4.572
docid024631 rev 2 7/8 stpsc6h12 ordering information 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode STPSC6H12B-TR1 stpsc 6h12b dpak hv 2l 0.368g 2500 tape and reel table 8. document revision history date revision changes 02-aug-2013 1 first issue. 05-aug-2013 2 corrected typographical error in table 7 .
stpsc6h12 8/8 docid024631 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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